Imishini yokumaka i-laser yefayibha isebenzisa umsebe we-laser onamandla aphezulu ogxile ngqo ebusweni be-PCB. Umphumela wokushisa uyahwamukisa noma ushise izendlalelo zensimbi noma zokumboza, uqopha amaphethini amahle, umbhalo, noma ususe ukumboza okweqile ngokunemba okuphezulu, okwenza kube kuhle kakhulu kumasekethe ayinkimbinkimbi kanye nokumakwa kwendawo encane.

Njengenqubo yokungathintani, ukumakwa nge-laser kususa ukuguguleka komshini, kulondoloza ubuso be-PCB. Ngaphezu kwalokho, akudingi izixazululo zokuqopha ngamakhemikhali, okuqinisekisa inqubo yokukhiqiza enobungani nemvelo futhi esebenza kahle.

Imishini yokumaka i-laser yefayibha igxila imisebe ye-laser enamandla aphezulu ebusweni bekhadi le-SD, okubangela izinguquko zombala (njengokubola kwe-oxidation noma ukushisa) noma ukuguqulwa kokuthungwa kwendawo ngemiphumela yokushisa, okwenza izimpawu zibonakale.

Le nqubo iqinisekisa ukunemba okuphezulu kokuphawula nokuqina, ivimbela ukuguguleka noma ukususwa, okwenza kube kuhle kakhulu ukusetshenziswa isikhathi eside kanye nokuhlonza idivayisi yokugcina izinto ngendlela ethembekile.

Imishini yokumaka i-laser ye-CO₂ isebenzisa umsebe we-laser we-infrared ongu-10.6μm ukudala izimpawu ezindaweni ze-module yememori. Uma igxile kwi-PCB, umphumela wokushisa onamandla aphezulu ufudumeza, ugcizelele, noma ubolise izinto, okuholela ekushintsheni kombala okwakha uphawu oluhlala njalo.

Njengenqubo yokungathintani, ukumakwa nge-laser akuthinti ukusebenza kukagesi noma amandla okugcina idatha emoduli yememori. Ukushisa okugxilile kuhlala phezu kobuso, kuqinisekisa ukuthi akukho mthelela kuma-chip noma amasekethe angaphakathi, kugcina ubuqotho bomkhiqizo nokuthembeka.

Imishini yokumaka nge-laser ye-UV isebenzisa izimpawu kuma-chips afakwe i-epoxy resin esebenzisa umthombo wokukhanya obandayo, okwenza kube nokunemba okuphezulu kokushaya kokushisa okuncane. Lokhu kuvimbela umonakalo wokushisa kuma-chip nezakhiwo ezizungezile, okuqinisekisa inqubo yokumaka ephephile kanye nobuqotho bezinto ezibonakalayo.

Ngokugcwala kwamandla aphezulu, ama-laser e-UV asusa ngokunembile ubuso be-epoxy resin, adale izimpawu ezibukhali nezihlala isikhathi eside. Lokhu kuthuthukisa kakhulu ukulandeleka kwama-chip ngenkathi kugcinwa ukuzinza kokupakishwa kanye nekhwalithi yomkhiqizo.

I-PA (i-Polyamide, ngokuvamile i-nylon) isetshenziswa kabanzi kuma-terminal block e-elekthronikhi, ezimoto, kanye nezimboni ngenxa yokumelana kwayo okuhle kakhulu nokuguguleka, ukumelana namakhemikhali, amandla aphezulu omshini, kanye nezakhiwo zokuvikela ugesi.

Ukumaka i-laser yefayibha kuvame ukusebenzisa imisebe ye-laser enobude obufushane, enamandla aphezulu (isb., 1064nm). Uma kugxilwe ebusweni be-PA, amandla agxilile abangela ukusabela kokushisa, okubangela ukuthi izakhi zekhabhoni ezintweni zi-oxidize bese zakha ungqimba olumnyama olufakwe ikhabhoni. Le nqubo ibolisa izingxenye eziphilayo, isuse umswakama kanye nokungaguquguquki, futhi ishiye uphawu olumnyama olucebile ngekhabhoni, iqinisekisa ukungafani okuphezulu kanye nokufundeka kalula uma kuqhathaniswa nezinto ze-PA.

Ukumaka nge-laser ye-UV kudala amamaki ahlala njalo futhi abonakala kakhulu ezindlini ze-optocoupler ngokusebenzisa i-carbonization kanye nokubola kokushisa. Le nqubo iqinisekisa ukunemba okuphezulu, ukugqama okunamandla, kanye nokuqina okuhle kakhulu. Ukumaka nge-laser ye-UV kusetshenziswa kabanzi ekuhlonzeni okuhlala njalo, izinombolo ze-serial, noma ama-logo enkampani ezindlini ze-optocoupler zohlobo lwe-terminal, ikakhulukazi ezisetshenziswayo zezimboni neze-elekthronikhi, okuqinisekisa ukucaca nokuzinza okuhlala isikhathi eside.